Recent Progress in Metallurgical Bonding Mechanisms at the Liquid/Solid Interface of Dissimilar Metals Investigated via in situ X-ray Imaging Technologies
نویسندگان
چکیده
The liquid/solid (L/S) interface of dissimilar metals is critical to the microstructure, mechanical strength, and structural integrity interconnects in many important applications such as electronics, automotive, aeronautics, astronautics, therefore has drawn increasing research interests. To design preferential microstructure optimize properties interconnects, it crucial understand formation growth mechanisms diversified structures at L/S during interconnecting. In situ synchrotron radiation or tube-generated X-ray radiography tomography technologies make possible observe evolution directly have greatly propelled this field. Here, we review recent progress understanding behaviors using advanced imaging techniques with a particular focus on following two issues: (1) solder joints for microelectronic packaging including intermetallic compounds (IMCs) reflow, Sn dendrites, IMCs solidification reflow porosities (2) characteristics morphological transition interconnect high temperature. Furthermore, main achievements future perspectives terms metallurgical bonding under complex conditions improved sources detectors are remarked discussed.
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ژورنال
عنوان ژورنال: Acta Metallurgica Sinica (english Letters)
سال: 2021
ISSN: ['2194-1289', '1006-7191']
DOI: https://doi.org/10.1007/s40195-021-01193-6